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Nokia

Principal PIC Process Engineer

Posted 3 Days Ago
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In-Office or Remote
Hiring Remotely in United States
Expert/Leader
In-Office or Remote
Hiring Remotely in United States
Expert/Leader
Senior individual contributor leading development, optimization, and transfer of InP PIC and laser fabrication processes for high-volume manufacturing. Responsibilities include epitaxial design, process flow development, process integration, SPC and statistical analysis, FMEA and root-cause work, metrology strategy, fab execution with remote partners, cross-functional collaboration, and mentoring.
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As a Principal PIC Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.

This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia’s high‑capacity optical networking platforms.


NION2026

Responsibilities

Process Development & Integration

  • Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturing
  • Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
  • Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
  • Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules

Manufacturing Data & Yield Excellence

  • Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
  • Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
  • Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
  • Define and utilize metrology strategies to ensure robust process control

Fab Execution & Cross‑Functional Collaboration

  • Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
  • Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
  • Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp

Technical Leadership & Impact

  • Provide technical leadership within the PIC process development domain
  • Contribute to continuous improvement of tools, methods, and best practices
  • Mentor junior engineers and support knowledge transfer across the broader team
Qualifications
  • Ph.D. in Electrical Engineering, Physics, or a related field
  • Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications
  • Deep expertise in: 
    • PIC device physics
    • Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation
    • Opto‑electronic testing of PIC devices
    • Modeling, simulation, scripting, and working with large, complex data sets
    • Physics‑based and data‑driven root cause analysis
  • Demonstrated ability to drive cross‑functional engineering teams to measurable outcomes
  • Excellent communication and organizational skills

Preferred Qualifications

  • Experience supporting technology transfer to high‑volume manufacturing
  • Familiarity with yield ramp, qualification, and reliability testing for photonic devices
  • Strong communication skills with the ability to translate complex technical issues across disciplines
  • Experience working in foundry or captive fab environments supporting compound semiconductor technologies
About Us
Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. 

Learn more about life at Nokia.


Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia. 

About the Team
Some of our benefits in US:
  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability, and long-term disability
  • Life insurance, and AD&D – Company paid 2x base pay
  • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
  • Paid time off for holidays and Vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.


Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

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