Teams at NEOTech

Perform VALOR-based DFM analyses of PCBA layouts against IPC and component guidelines, produce risk-assessed reports recommending design changes to improve manufacturability, quality, and yield.

Lead design, development, and validation of RF/microwave circuits and high-frequency PCBs. Perform schematic capture, simulation, layout, and material selection. Use ADS, HFSS, and AWR for modeling; optimize impedance matching, SI, and EMI. Develop test plans and validate with VNAs, spectrum analyzers, and signal generators. Collaborate with mechanical, PCB, and manufacturing teams, support prototypes and production ramp, and interface with customers.

Design complex multi-layer (rigid, rigid-flex, HDI) PCBs for high-reliability aerospace, defense, industrial, and medical products. Lead component placement, high-speed and RF routing, stack-up definition, and SI/PI, EMI/EMC, thermal, and grounding strategies. Produce fabrication/assembly documentation, run DFM/DFT reviews, support CAD environments, and mentor team members.