Teams at Texas Instruments

Leads semiconductor process engineering teams supporting 300mm high-volume manufacturing. Owns tool installation, process release, capacity enablement, cost reduction, sustaining engineering, excursion response, root-cause resolution, SPC governance, and continuous improvement. Partners with manufacturing, equipment, integration, technology, yield, operations, and facilities teams while reporting operational performance to senior leadership.

Leads a cross-functional semiconductor process engineering team developing advanced analog technology. Oversees process optimization across major wafer-fabrication modules, process integration, root-cause resolution, technology transfer, and concurrent development programs. Manages workforce planning, performance, succession, and talent development while coordinating with integration, device, equipment, manufacturing, and operations teams. Communicates program status, risks, and technology readiness to site and executive leadership.

Leads a semiconductor manufacturing engineering section responsible for factory-wide defect metrology, yield improvement, excursion management, process control, and quality systems. Manages engineers and technicians, drives SPC governance and automated containment, presents performance updates to executive leadership, and champions AI-enabled manufacturing and continuous improvement across multiple wafer-fabrication technology nodes.