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Tenstorrent Inc.

Chip Design Lead

Posted 2 Days Ago
Be an Early Applicant
Remote
Hiring Remotely in United States
100K-500K Annually
Senior level
Remote
Hiring Remotely in United States
100K-500K Annually
Senior level
As a Chip Design Lead at Tenstorrent, you will oversee the development of SoC programs from architecture to deployment, ensuring collaboration across teams and managing chip lifecycle processes.
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Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is building cutting-edge processors and systems for AI workloads, bringing together world-class expertise in silicon, systems, and software. We are looking for an experienced Chip Design Lead to drive complex SoC programs from architecture definition through execution, tapeout, and deployment.

This is a senior technical leadership role for someone who understands the full chip development lifecycle and has successfully led at least one chip from definition to tapeout. The ideal candidate brings strong cross-functional leadership, deep technical credibility across front-end design flows, and the ability to work closely with back-end teams, external vendors, and customers. 

This role is remote, based out of North America.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.


Who You Are

  • You have led at least one chip program from definition to tapeout in a technical leadership capacity.
  • You have a strong understanding of the end-to-end chip development process, from architecture and SoC definition through RTL, verification, physical implementation, tapeout, and post-silicon deployment.
  • You bring hands-on experience in one or more core front-end domains such as architecture, RTL design, or verification, along with enough breadth to lead across the full program.

What We Need

  • Proven experience leading at least one chip program from architecture definition through tapeout in a technical leadership capacity.
  • Strong understanding of end-to-end SoC development flows, including architecture, RTL design, verification, physical implementation, and post-silicon bring-up.
  • Hands-on expertise in one or more core front-end domains such as architecture, RTL development, or verification.
  • Ability to drive cross-functional collaboration across design, verification, physical design, external vendors, and program stakeholders to execute complex chip development programs successfully.

What You Will Learn

  • Gain exposure to cutting-edge AI processor and system architectures built for advanced machine learning workloads.
  • Expand your expertise across the full chip lifecycle, including SoC definition, RTL execution, verification, physical implementation, tapeout, and bring-up.
  • Learn how to lead and coordinate large-scale chip programs across globally distributed engineering teams and external partners.
  • Work alongside world-class experts in silicon, systems, and software to help shape next-generation AI compute platforms.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.  Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).   These requirements apply to persons located in the U.S. and all countries outside the U.S.  As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.  If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

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