Design and validate high-speed packages, develop EDA tools and automation flows, model package structures, and ensure consistency in design processes.
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.
This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.
Responsibilities- Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
- Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
- Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
- Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
- Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
- Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
- Provide technical input and design validation for vendor-supported automation and enablement efforts
- Support continuous improvement of package design methodologies and best practices across projects
Required Qualifications
- MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
- 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
- Strong fundamentals in electromagnetics, signal integrity, and power integrity
- Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
- Ability to work independently and collaboratively in a cross-functional, research-driven environment
Preferred Qualifications
- Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
- Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
- Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
- PCB design and technology (e.g., Altium or equivalent)
Similar Jobs
.png)
eCommerce • Fintech • Hardware • Payments • Software • Financial Services
Lead Square-wide Trust strategy across Risk and Identity, owning high-stakes Trust bets while coaching senior PMs. Drive product for Identity Verification, Access, Disputes, and Controls; optimize seller experience, risk loss, and ecosystem health. Operate AI-native, engage regulators and partners, and coordinate Product, Engineering, Compliance, Legal, and Operations to deliver Trust and Safety initiatives.
Top Skills:
JumioMl/AiOnfidoPersonaVeriff
eCommerce • Fintech • Hardware • Payments • Software • Financial Services
Lead end-to-end delivery of high-priority, cross-functional Revenue initiatives including product and partnership launches. Develop integrated program plans, establish governance and operating cadences, drive cross-functional alignment, manage risks and dependencies, and create repeatable launch frameworks and executive communications to ensure successful market readiness and post-launch stabilization.
Artificial Intelligence • Cloud • Information Technology • Sales • Security • Software • Cybersecurity
Perform top-of-funnel business development to identify, qualify, and generate pipeline. Prospect enterprise and mid-market accounts through phone, email, and LinkedIn; meet daily activity targets; manage leads in Salesforce and Salesloft; collaborate with Account Executives and Marketing to create qualified opportunities; deliver consultative value propositions and territory expertise to support quarterly revenue goals.
Top Skills:
GongLinkedin Sales NavigatorSaaSSalesforceSalesloft
What you need to know about the Chicago Tech Scene
With vibrant neighborhoods, great food and more affordable housing than either coast, Chicago might be the most liveable major tech hub. It is the birthplace of modern commodities and futures trading, a national hub for logistics and commerce, and home to the American Medical Association and the American Bar Association. This diverse blend of industry influences has helped Chicago emerge as a major player in verticals like fintech, biotechnology, legal tech, e-commerce and logistics technology. It’s also a major hiring center for tech companies on both coasts.
Key Facts About Chicago Tech
- Number of Tech Workers: 245,800; 5.2% of overall workforce (2024 CompTIA survey)
- Major Tech Employers: McDonald’s, John Deere, Boeing, Morningstar
- Key Industries: Artificial intelligence, biotechnology, fintech, software, logistics technology
- Funding Landscape: $2.5 billion in venture capital funding in 2024 (Pitchbook)
- Notable Investors: Pritzker Group Venture Capital, Arch Venture Partners, MATH Venture Partners, Jump Capital, Hyde Park Venture Partners
- Research Centers and Universities: Northwestern University, University of Chicago, University of Illinois Urbana-Champaign, Illinois Institute of Technology, Argonne National Laboratory, Fermi National Accelerator Laboratory
