Lead EDI architecture and implementation using Oracle and Cleo platforms. Design scalable B2B integrations, manage communication protocols (AS2, SFTP, HTTPS, API), create EDI maps (X12, EDIFACT), onboard trading partners, integrate with ERPs, optimize processes, lead UAT, and provide Tier 3 support and mentorship.

Leads DFM and DFA analysis for complex PCB assemblies, using Siemens Valor and related tools to assess manufacturability, develop IPC-aligned design rules, and resolve production concerns. Designs high-density multilayer PCB layouts from schematics using Altium or equivalent tools, creating stack-ups, routing, libraries, and manufacturing deliverables. Collaborates with engineering, manufacturing, quality, customers, and suppliers while driving PCB standards, continuous improvement, and production readiness.